Solder Paste - Company Ranking(8 companies in total)
Last Updated： Aggregation Period:Dec 17, 2025〜Jan 13, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Specifications】 ■Compatible solder alloys: J3 (Sn-Ag3.0-Cu0.5), R4 (Sn-Ag0.3-Cu0.7) ■Powder particle size: 38 to 20µm ■Flux content: 11... | - Soldering at ROL0 - Soldering to mobile components | ||
| For more details, please feel free to contact us. | For more details, please feel free to contact us. | ||
| 【Specifications】 ■Compatible solder alloy: Sn5-Pb92.5-Ag2.5 ■Flux type: MIL-RMA ■Halide content: 0.10±0.04% ■Powder particle size: 45～... | High-heat generating components such as power semiconductors. | ||
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石川金属
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- Featured Products
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Halogen-free solder paste "EVASOL 7100 Series"
- overview
- 【Specifications】 ■Compatible solder alloys: J3 (Sn-Ag3.0-Cu0.5), R4 (Sn-Ag0.3-Cu0.7) ■Powder particle size: 38 to 20µm ■Flux content: 11...
- Application/Performance example
- - Soldering at ROL0 - Soldering to mobile components
Soldering defect: void (solder paste)
- overview
- For more details, please feel free to contact us.
- Application/Performance example
- For more details, please feel free to contact us.
Sn-Pb high melting point solder paste "Sordim Series"
- overview
- 【Specifications】 ■Compatible solder alloy: Sn5-Pb92.5-Ag2.5 ■Flux type: MIL-RMA ■Halide content: 0.10±0.04% ■Powder particle size: 45～...
- Application/Performance example
- High-heat generating components such as power semiconductors.
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石川金属
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